100mm Sponge Polishing Pad For Optical Glass
This polishing pad from Aozhong is specifically designed for precision surface finishing, a field in which pressure control, slurry retention, and contact uniformity all influence the final surface finish. In optical and wafer-related polishing processes, the surface is typically processed using a combination of polishing pads, slurry, pressure, rotation, and processing time. CMP (Chemical Mechanical Polishing) and polishing processes utilize polishing pads and slurry to smooth or flatten wafer surfaces through mechanical and chemical action.
The product shown features a black mesh surface, a yellow sponge cushion layer, and a light-colored backing. The black mesh surface provides contact texture and channels for the slurry. The sponge layer provides compression and rebound properties. The back supports hook-and-loop fastening or polishing pad mounting, depending on the final configuration.
During the grinding and polishing of optical components, slurry is typically used between the workpiece and the tool or polishing pad. Surface profile, scratches, pits, and surface roughness are critical control points in optical manufacturing.
This sponge polishing pad is designed for optical glass, semiconductor substrates, glass wafers, ceramic substrates, lenses, filters, and flat surface lapping processes that require pressure damping and slurry-based finishing.
This pad is suitable for processes that require pressure damping rather than fixed abrasive cutting. It supports polishing, lapping, slurry finishing, process testing, and small-batch production.
The sponge polishing pad is suitable for slurry-based finishing and flat surface lapping, especially where the process depends on pressure distribution, controlled contact, and surface consistency rather than aggressive abrasive cutting.
The sponge polishing pad is built with a black mesh surface layer, yellow foam cushioning layer, light-colored fabric backing layer, and adhesive layers between each functional structure.
This structure supports slurry flow, surface contact, pressure distribution, vibration absorption, and secure attachment to compatible hook-and-loop backing pads.
Surface Layer
Cushioning Layer
Backing Layer
Adhesive Layer
Designed to facilitate slurry flow and provide contact support during polishing, lapping, and precision surface finishing.
Designed for pressure distribution and vibration absorption, helping maintain more stable contact between the pad and workpiece.
Designed for secure attachment or Velcro fastening on compatible hook-and-loop polishing and sanding systems.
Located between the surface layer, foam layer, and backing layer to bond the structure into a stable polishing pad.
This sponge polishing pad is designed for precision polishing processes where pressure damping, slurry movement, contact stability, and material protection are important.
This product should be used when standard hard polishing wheels may cause indentations, edge stress, or unstable contact. The sponge layer helps alleviate localized pressure when processing brittle materials.
The sponge layer helps reduce localized pressure during polishing, making the pad suitable for materials that may be sensitive to hard-wheel contact.
The mesh surface helps retain polishing slurry in the work area and move it across the contact interface during polishing.
Stable contact between the polishing pad, slurry, and workpiece helps support surface consistency during precision polishing, lapping, and finishing operations.
Polishing pad selection should be based on workpiece material, target roughness, flatness requirements, slurry specification, process pressure, speed, time, and equipment.
